Nanoelectronic Device Applications Handbook, ed. Academic Innovation Process in Germany Mastery of the innovation process in an academic environment. Simulation of capacity and cost for the planning of future process chains. Februar, , Pages Kiew, Ukraine, pp , Combining Simulation and Capacity Planning.
Winter Simulation Conference, Proceedings pp. Increasing resource-efficiency in production with energy constraints by discrete-event simulation. Biokompatible Verbindungstechniken von aktiven Mikrosystemen mit Implantaten. Zentralverband Elektrotechnik- und Elektronikindustrie e. Iterative simulation-based optimization for parallel batch scheduling problems. Interconnect Technology for 3D Chip Integration abstract, oral presentation. Tagung "Zukunft des Technologietransfers", Development of radiation resistant, direct converting X-ray line detectors in terms of their assembly technology.
Room temperature wedge — wedge ultrasonic bonding using aluminium coated copper wire. Combination of simulation and capacity optimization for detailed production scheduling in semiconductor manufacturing. Optimisation approaches for batch scheduling in semiconductor manufacturing. Paper und eingeladener Vortrag im Rahmen der 2. Simulation und Optimierung in Produktion und Logistik, S.
A multistage mathematical programming based scheduling approach for lithography in complex semiconductor manufacturing systems. Eingeladener Vortrag auf dem 7. Eckert, T; Tetzner, K. Sensitivity analysis of technological fabrication tolerances on the lifetime of flip-chip solder joints. New Assessment Criteria for Laboratory Methods,. Vortrag auf dem Tutorial: Workshop "Nanoscaled Materials for Electronics Systemintegration" am Investigation of MIP approaches for batch scheduling in semiconductor manufacturing.
International Journal of Production Research, Vol. Manufacturing and electrical interconnection of piezoelectric composite materials for phased array ultrasonic transducers. Electronics System-Integration Technology Conference, Intermetallic compound growth in lead free solder joints on Ag-based thick film coductors. International Journal of Computer Integrated Manufacturing, pp. Definition and Determination of the rheological Properties critical for the Microapplication of Adhesives. Automated generation and parameterization of throughput models for semiconductor tools.
Methodenapparat zur Qualifizierung einer bleifreien Montagetechnologie am Beispiel der Lotpastenauswahl. Vortrag auf dem Technologietag der Firma C. Leuze Verlag, Bad Saulgau. Simulation in Produktion und Logistik Oktober , Tagungsband zur Replace of vias with polymer thick film pastes PTF for the use on flexible substrates. Werkstofftechnisches Kolloquium, Chemnitz am September , Tagungsband zur 7.
Oktober , Bad Homburg. Agent-based interbay system control for a single-loop semiconductor manufacturing fab. Investigation of modified heuristic algorithms for simulation-based optimization. Evaluation of thickfilm conductive pastes by using lead free solder alloys. Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Marienthal, Germany, May 10th to 14th, X-ray and Ultrasonic Microscopy. Zuverlassigkeitsanalysen an komplexen elektronischen Baugruppen mittels Rontgen- und Ultraschallmikroskopie.
Kongress "Systemintegration in der Mikroelektronik" Erfahrungen beim Einsatz der statistischen Versuchsplanung in der Elektronikproduktion. Chancen, Nutzen und Grenzen.
Marienthal, Germany, May 10th to 14th, , pp. Simulation in Produktion und Logistik , Kassel, Jahrgang, Heft 7, S. Leuze Verlag , A limited-angle CT approach for a fast scanned electron-beam X-ray tomography with application to multiphase flow measurements. Technology downscale for optical waveguides in cost performance electrical-optical circuit boards. Spectrometric analysis of cell viability on electronic packaging materials. Bilbao, July , , Proceedings pp. Meeting the Challenges of Electronics Technology Progress. Institutskolloquium Aufbau- und Verbindungstechnik, Dresden, Elektronik-Technologie in Forschung und Praxis, Herausgeber: Fachbuchverlag Leipzig im Carl Hanser Verlag, White Light Interferometry, a method for optical 3D-inspection of advanced packages.
Reliability of lead free solders joints and manufacturability during the SMT process. Improvement of the adhesion of new memory packages by surface engineering. Leuze Verlag, Heft 9, September , S. Institutskolloquium Aufbau- und Verbindungstechnik am Vergleich des Flussprofils einer pulsatil gesteuerten Rollerpumpe mit den pulsatilen Eigenschaften einer Axialblutpumpe in der extrakorporalen Zirkulation. PCB integrated waveguides - Launching light into highly multi mode structures.
Jahrgang, Heft 12, S. Oktober an der TU Dresden. Investigation on the applicability of material models for board level lead free solder joints in high temperature electronics. Finite Element Analysis to develop a new accelerating test method for board level solder joints for high temperature electronics.
Anwendung der Computertomografie in der Aufbau- und Verbindungstechnik der Elektronik. Trainingsfragen - Praxisbeispiele - Multimediale Visualisierung. Herausgeber ; Oppermann, M. Warum sind hochdichte Baugruppen HDI zunehmend erforderlich?
Publikationen
Workshop Photonics in Electronics Technologies, Dresden, Detert, , ISBN Vortrag auf dem Seminar: Marbella, Spain, September , Proceedings p. Dublin, Ireland, July , Proceedings p. Optimierung von Fertigungsverfahren in der Elektronik-Technologie durch evolutionstheoretische Methoden, Dresden, USA , September Generation of optical waveguides on PCBs using printed wiring board Technologies.
Forschungsergebnisse des Graduiertenkollegs, w. The "Center of Microtechnical Manufacturing" CMM and its fundamentals for production in electronic technologies and contributions for mechatronics. Electronic Components and Technology Conference, Mai Las Vegas.
IAVT: Referenzen
Eine neue Integrationsstufe in der Elektronik und Sensorik, Optical interconnection possibilities for printed circuit boards: Balatonfuered Hungary , May, Vortrag auf dem ISSE 98 May , Neusiedl am See, Austria. Vortrag und Proceedings im Rahmen des 5. Workshops Mikrotechnische Produktion, Vortrag im Rahmen des Vortrag und Proceedings im Rahmen der 7.
Optimisation of fabrication procedures by evolutionary methods in the electronics technology. Neusiedl am See, Austria, May , Posterpresentation. Wissenschaftliche Berichte der Internationalen Wissenschaftlichen Konferenz Mittweida, , S.
Contributions to Conferences (reviewed)
A low temperature cofiring ceramic LTCC chamber for characterization of internal electric particle properties by a laseroptical method. Eurosensors IX, Warschau, September Warsaw, Poland, November , Proceedings S. Szklarska Poreba, Poland, June , Posterbeitrag. European Conference on Integration in Manufacturing. Journal of Infrared and Millimeter Waves, Vol. Conference-Proceedings pp , Pilsen, 15 - 16 April , p.
Conference Proceedings , pp. Tagungsband Medizinische Physik , Conference-Proceedings TUeF, - , Intelligent airborne ultrasonic presence and position detector for conveyor installations. Mildred Scheel, 25 - 27 Nov. Oktober , Erlangen, Tagungsband , pp. Applied Physics 26 , pp. RRS and 13th Ann. Annual Meeting of the Radiation Research Society and the March , Dallas, Texas , Tagungsband, Medizinische Physik , Microwave Symposium , Albuquerque. In Hyperthermia in Clinical Oncology, Abstracts , p.
Technische Anwendungen von Fuzzy-Systemen , pp. Mai , Garmisch-Partenkirchen , Plenum Press, New York , pp.
Juni , Band 1 , pp. VDI Reihe 9 Nr. Military Microwaves '86, 24 - 26th June , Brighton , UKW-Berichte 25 , Heft 4 , pp. Conference on Infrared and Millimeter Waves. UKW-Berichte 24 , Heft 1 , pp. Landesausschusses Deutschland , pp. Adelphi MD , Parts I and II, D. Reidel Publishing Company, Dordrecht - Holland , pp.
Publikationen
UKW-Berichte 22 , Heft 3 , pp. UKW-Berichte 22 , Heft 4. Hill, Plenum Press, New York , pp. September , Plenum Press, New York, ed. Neue Techniken zur Diagnostik.
- Liste der Veröffentlichungen?
- Charade: The Games Trilogy 1: The Games Trilogy 1.
- Contributions to Journals (reviewed)!
Thieme Verlag , pp. Witzstrock, Baden-Baden , pp.